Complaint
| Production Ability For PCB | |
| Layer: | 1-40 layer |
| Surface: | HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. |
| Copper thickness: | 0.25 Oz -12 Oz |
| Material: | FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers |
| Board thickness | 0.1 to 6.0mm(4 to 240mil) |
| Minimum line width/space | 0.076/0.076mm |
| Minimum line gap | +/-10% |
| Outer layer copper thickness | 140um(bulk) 210um(pcb prototype) |
| Inner layer copper thickness | 70um(bulk) 150um(pcb protytype) |
| Min.finished hole size(Mechanical) | 0.15mm |
| Min.finished hole size (laser hole) | 0.1mm |
| Aspect ratio | 10:01(bulk) 13:01(pcb prototype) |
| Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey |
| Tolerance of dimension size | +/-0.1mm |
| Tolerance of board thickness | <1.0mm +/-0.1mm |
| Tolerance of finished NPTH hole size | +/-0.05mm |
| Tolerance of finished PTH hole size | +/-0.076mm |
| Delivery time | Mass:10~12d/ Sample:5~7D |
| Capacity | 35000sq/m |
| Production Ability For PCB Assembly | |
| Stencil Size: | 640x640mm |
| Minimum IC Pitch: | 0.2mm |
| Minimum chip size: | 0201 (0.2x0.1) |
| Min. space of BGA: | 0.3mm |
| Max.precision of IC assembly: | ±0.03mm |
| SMT capacity: | ≥2 million points/day |
| DIP capacity: | ≥100k parts/day |
| electronic product final assembly: | electronic product final assembly: |
| Certification: | ISO9001:2015, ISO13485:2016, IAFT16949:2016 |
